Introduction to the technology of rigid-flex circuit board

- Feb 12, 2020-

Structural form of rigid and flexible composite plates

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The rigid and flexible laminates are one or more rigid layers on the flexible plate, and the circuits on the rigid layer are connected to each other by metallization. Each rigid and flexible composite plate has one or more rigid zones and one flexible zone. The following is a simple combination of rigid and flexible plates with more than one layer.


In addition, the combination of a flexible plate and several rigid plates, the combination of several flexible plates and several rigid plates, using drilling, plating holes, lamination process to achieve electrical interconnection. According to the design needs, the design concept is more suitable for the installation and debugging of the device and the welding operation. Ensure better use of the advantages and flexibility of rigid and flexible composite panels. This situation is more complex, with more than two layers of wire. As follows:

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Laminate is the copper foil, p-chip, memory flexible lines, the outer layer of rigid lines pressed into multilayer. The lamination of a rigid plate is different from that of only a soft plate or a rigid plate. Considering the deformation of the flexible plate during the lamination process, the surface flatness of the rigid plate should be considered. Therefore, in addition to material selection, the design process needs to take into account the appropriate thickness of the rigid plate, in order to ensure that the expansion and shrinkage of the rigid part of the consistent no warpage. The results show that 0.8-1.0 mm thickness is suitable. At the same time, we should pay attention to the rigid plate and flexible plate from the bonding position at a certain distance to place the hole, so as not to have an impact on the rigid flexure bonding part.

 

Production process of rigid and flexible laminates

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Rigid-Flex board is a combination of FPC and PCB. The production of soft and hard composite plate should have both FPC production equipment and PCB processing equipment. First, the electronic engineer draws the line and shape of the soft bonding board according to the demand, then sends it to the factory that can produce the soft and hard bonding board, through the cam engineer to process and plan the related documents, then arrange the production of the fpc and pcb for the production line of the fpc production line. After the two soft and hard boards come out, the fpc and the pcb are pressed seamlessly according to the requirements of the electronic engineer, and then after a series of details, the process is finally the soft bonding board.This four-layer plate (two-layer hard plate and two-layer soft plate) is an example1+2F+1).