New Rigid Flex PCB Design Choice For Layer Stackup

- Aug 14, 2019-

Polar Instruments releases Speedflex rigid flex PCB capability to its Speedstack layer stackup design system.


Polar Instruments claimed it added a rigid flex PCB (printed circuit board) design option to its Speedstack PCB layer stackup design system, which the firm said allows OEM developers and PCB manufacturers to develop and precisely record PCB stackups, integrating rigid and rigid flex PCB, and to minimize manufacturing prices through fast examination of a large range of alternate materials and suppliers.


The firm stated the Speedflex option gives developers with an ultra fast procedure that can build rigid flex PCB stacks in mins, file drills, present the heaps as a 2 or three-dimensional photo, and add regulated impedance, with goal-seeking, to complete the design. Speedstack does not limit the variety of layers that can be included, or the number of cross-sections that can be produced and contrasted, including coverlays, adhesives, and no-flow prepreg layers, allowing even more flexibility to fine tune the stack design for optimal price and performance.


The completed stack is recorded automatically and can be exported in industry conventional data layouts, which aids get rid of manual errors and guarantees that the PCB specifications are communicated clearly and constantly to every company and person in the design and PCB fabrication procedure.


While error-free documents tightens up control over the finished board, Speedflex additionally supplies the flexibility for PCB manufacturers to safely lower pcb manufacturing costs. Libraries of materials, vendors, costs and lead-times highlight the impact that changing materials or suppliers will certainly carry the price, lead-time and electrical specs of the completed board, which helps reduce the moment required to by hand determine the difference of each slight modification to the board and gives a lot more chances to discover the most affordable materials and providers within the electrical specifications of the finished board.