X-pcb is a leading factory of prototypes and volume pcb in Shenzhen. We can offers a wide range of different printed circuit boards to our customers in the world.
Soldermask bridge between solder dam: 4 mil (0.10 mm)
Minimun soldermask annular: 1.5 mil (0.038 mm)
Plugged hole size: 0.15 mm - 0.5 mm
Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating.
Special techniques: Blind and buried vias (min hole size is 0.1 mm), high layer with heavy copper.
The mentioned pcb is 8 layer rigid flex pcb board. The board thickness is 1.0mm with 1oz copper. Black solder mask and yellow coverlay are used on this board. The finishing is Electroless Nickel/ Immersion Gold.
Sample lead time
7628(0.18mm) 2116(0.12mm) 1080(0.08mm)
Air, Sea, Express
Product Feature And Application
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
The BGA in this boad is 0.2mm which is harder to fabricate. Its Min. trace width/ space is 3mil, and it has contorlled impeance, so the requirement of trace width and space is strict.
Why buy PCB from X-PCB?
● Advanced and full range of manufacturing facilities, we own the key high-end equipment for multilayer PCB, such as Laminator, Double-drawer Pinless Machine, X-Ray Drilling machine, CCD Automatic exposure machine, etc.
● Offer expedited service for prototyping, small batch production.
● PCB factory passed UL, ISO90001: 2008 and ISO/TS16949: 2009 certification, which is the strong confidence for quality.
● Free DFM: If customers need DFM before payment,we can provide free DFM.